Portable computer display structures

ABSTRACT

An electronic device housing may have upper and lower portions that are attached with a hinge. At least one portion of the housing may have a rear planar surface and peripheral sidewalls having edges. A display module may be mounted in the housing. The display module may have glass layers such as a color filter glass layer and a thin-film transistor substrate. The color filter glass layer may serve as the outermost glass layer in the display module. The edges of the display module may be aligned with the edges of the peripheral housing sidewalls to create the appearance of a borderless display for the electronic device. The display module may be provided with an opening that allows a camera or other electronic components to receive light. Traces may be provided on the underside of the thin-film transistor substrate to serve as signal paths for the electrical components.

BACKGROUND

This invention relates to electronic devices and, more particularly, todisplay structures for electronic devices such as portable computers.

Portable computers typically have upper and lower housing portions thatare connected by a hinge. The lower housing portion contains componentssuch as printed circuit boards, disk drives, a keyboard, and a battery.The upper housing portion contains a display. When the computer is in anopen configuration, the upper housing portion is vertical and thedisplay is visible to the user of the portable computer. When thecomputer is closed, the upper housing lies flat against the lowerhousing. This protects the display and keyboard and allows the portablecomputer to be transported.

Portable computer displays typically contain fragile structures such aslayers of glass and can be challenging to mount properly within theupper housing. If care is not taken, the display and the surroundingportions of the upper housing will be bulky and unsightly. At the sametime, the elimination of certain structures in the display may result indisplay that is overly fragile. This could lead to damage to the displayduring normal use.

It would therefore be desirable to be able to provide improved displaystructures in electronic devices such as portable computers.

SUMMARY

An electronic device such as a portable computer may have a housing. Thehousing may have upper and lower portions that are connected by a hinge.A display module may be mounted in a portion of the housing such as theupper housing portion.

The upper housing may have a planar rear surface and portions thatextend upwards to form peripheral housing sidewalls. The housingsidewalls may extend around the display module to form a border or thedisplay module may be mounted so that the outermost edges of the displaymodule are aligned with the outermost edges of the peripheral housingsidewalls.

The display module may have a color filter glass layer and a thin-filmtransistor substrate layer. A layer of light-guide structures may bemounted under the thin-film transistor substrate layer. The peripheraledges of the color glass layer and the thin-film transistor substratelayer may extend laterally past the peripheral edges of the light guidestructures to form an overhanging structure. The overhanging structuremay rest on the peripheral housing edges without any intervening displaymodule chassis members.

An opening may be provided through the color filter and thin-filmtransistor substrate layers. A camera may receive light through theopening. Other electronic components may also be mounted within thehousing of the electronic device such as ambient light sensors,proximity sensors, other sensors, indicator lights such a light-emittingdiodes, input-output ports, buttons, microphones and speakers, antennas,etc. These electrical components can be electrically connected to tracesformed on the underside of the thin-film transistor substrate layer ortraces formed on other glass surfaces.

To block unsightly portions of the device from view around the peripheryof the display module, the display module may be provided with an opaqueborder. The opaque border may be formed from a peripheral ring of blackink. The black ink may be formed on a glass layer such as the colorfilter glass. A polymer film that includes a black ink may also be usedin forming the opaque border.

If desired, the display module may contain no cover glass layers. Inthis type of configuration, the outermost glass layer in the displaymodule may be formed from the color filter glass. The polymer film layerand other layers such as polarizing layers may be formed on top of thecolor filter glass layer.

The display module may contain integrated circuits such as displaydriver circuits. A display driver circuit may be mounted on thethin-film transistor substrate. A support structure such as a glassmember with a recess to accommodate the drive circuit may be placed overthe driver circuit. The support structure may support coating layerssuch as the polymer film layer with the opaque border.

Further features of the invention, its nature and various advantageswill be more apparent from the accompanying drawings and the followingdetailed description of the preferred embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an illustrative portable computer withdisplay structures in accordance with an embodiment of the presentinvention.

FIG. 2 is a cross-sectional side view of a conventional liquid crystaldisplay (LCD) module in a portable computer display housing.

FIG. 3 is a cross-sectional side view of an edge portion of aconventional LCD module.

FIG. 4 is a cross-sectional side view of an illustrative display modulein an electronic device such as a portable computer in accordance withan embodiment of the present invention.

FIG. 5 is a cross-sectional side view of an illustrative display modulewith a thin plastic coating that has a border region that is coated withan opaque ink in accordance with an embodiment of the present invention.

FIG. 6 is a cross-sectional side view of a portion of an illustrativedisplay module for an electronic device such as a portable computer inaccordance with an embodiment of the present invention.

FIG. 7 is a cross-sectional side view of a portion of an illustrativedisplay module that has extending portions that rest on housing walls inan electronic device such as a portable computer in accordance with anembodiment of the present invention.

FIG. 8 is a cross-sectional view of an illustrative electronic deviceshowing how components such as a camera module and antenna may be formedthrough an opening in display module layers such as a color filter glasslayer and thin-film transistor substrate layer in accordance with anembodiment of the present invention.

FIG. 9 is a cross-sectional side view of an illustrative electronicdevice showing how a camera module or other electronic component may bemounted to the underside of a layer of glass in a display module and howthe component may operate through a clear window region in the glass inaccordance with an embodiment of the present invention.

FIG. 10 is a perspective view of a portion of a display module in whichan electrical component has been mounted to an upper surface of athin-film transistor substrate layer and in which conductive traces havebeen formed that route signals on the upper surface of the thin-filmtransistor substrate outside of the active area of the display module inaccordance with an embodiment of the present invention.

FIG. 11 is a perspective view of a portion of a display module in whichan electrical component has been mounted to an upper surface of a colorfilter glass layer and in which conductive traces have been formed thatroute signals outside of the active area of the display module inaccordance with an embodiment of the present invention.

FIG. 12 is a cross-sectional side view of a portion of a display moduleshowing how edge portions of layers of glass such as a cover glasslayer, color filter, and thin-film transistor substrate layer may reston a housing wall ledge above a metal chassis portion in accordance withan embodiment of the present invention.

FIG. 13 is a cross-sectional side view of a portion of a display modulein which an elastomeric trim structure has been used to cover theuppermost surfaces of a housing wall in accordance with an embodiment ofthe present invention.

DETAILED DESCRIPTION

An illustrative electronic device such as a portable computer in whichdisplay structures may be provided is shown in FIG. 1. As shown in FIG.1, portable computer 10 may have housing 12. Housing 12, which issometimes referred to as a case, may be formed from one or moreindividual structures. For example, housing 12 may have a mainstructural support member that is formed from a solid block of machinedaluminum or other suitable metal. One or more additional structures maybe connected to the housing 12. These structures may include, forexample, internal frame members, external coverings such as sheets ofmetal, etc. Housing 12 and its associated components may, in general, beformed from any suitable materials such as such as plastic, ceramics,metal, glass, etc. An advantage of forming housing 12 at least partlyfrom metal is that metal is durable and attractive in appearance. Metalssuch as aluminum may be anodized to form an insulating oxide coating.

Housing 12 may have an upper portion 26 and a lower portion 28. Lowerportion 28 may be referred to as the base or main unit of computer 10and may contain components such as a hard disk drive, battery, and mainlogic board. Upper portion 26, which is sometimes referred to as acover, lid, or display housing, may rotate relative to lower portion 28about rotational axis 16. Portion 18 of computer 10 may contain a hingeand associated clutch structures and is sometimes referred to as aclutch barrel.

Lower housing portion 28 may have a slot such as slot 22 through whichoptical disks may be loaded into an optical disk drive. Lower housingportion may also have a touchpad such as touchpad 24 and may have keys20. If desired, additional components may be mounted to upper and lowerhousing portions 26 and 28. For example, upper and lower housingportions 26 and 28 may have ports to which cables can be connected(e.g., universal serial bus ports, an Ethernet port, a Firewire port,audio jacks, card slots, etc.). Buttons and other controls may also bemounted to housing 12. Speaker openings such as speaker openings 30 maybe formed in lower housing portion 28 by creating an array of smallopenings (perforations) in the surface of housing 12.

A display such as display 14 may be mounted within upper housing portion26. Display 14 may be, for example, a liquid crystal display (LCD),organic light emitting diode (OLED) display, or plasma display (asexamples). Display 14 may contain a number of layers of material. Theselayers may include, for example, layers of optically transparent glass.Layers of plastic and optical adhesive may also be incorporated intodisplay 14. In a liquid crystal display, layers of polarizer, lightdiffusing elements and light guides for backlight structures, a liquidcrystal layer, and a thin-film transistor array that drives the imagepixels in the display may be incorporated into the display. Thecollection of material layers and associated support structures that areused to form display 14 are sometimes referred to as a module. Display14 may therefore sometimes be referred to as a display module.

Computer 10 may have input-output components such as touch pad 24. Touchpad 24 may include a touch sensitive surface that allows a user ofcomputer 10 to control computer 10 using touch-based commands(gestures). A portion of touchpad 24 may be depressed by the user whenthe user desires to “click” on a displayed item on screen 14.

A cross-sectional side view of a conventional liquid crystal display(LCD) display module is shown in FIG. 2. As shown in FIG. 2, displaymodule 32 may have display structures 46 such as an upper polarizerlayer, a color filter, a thin-film transistor glass layer, a lowerpolarizer, and a layer of light-guide structures such as light guidesand diffuser layers. Display module 32 may also have a plastic chassismember such as plastic chassis member 44 and a metal chassis member suchas metal chassis member 42 into which the layers of glass and otherdisplay module structures may be mounted. Cover glass 36 may be placedon top of structures 46.

Metal chassis member 42 may have a tab with a hole through which screw40 passes. Screw 40 may be screwed into a threaded hole in housing 34.In the arrangement of FIG. 2, housing 34 is formed of aluminum. Thepresence of the extending tab portion of chassis 42 allows module 32 tobe firmly secured in housing 34, but adds undesirable width to theperimeter of display module 32.

Elastomeric gasket 38 is used to form a cushioned interface betweencover glass layer 36 and housing 34. This helps to prevent damage tocover glass layer 36. Cover glass 36 is formed from clear glass andhelps to protect layers 46 of LCD module 32 from damage, but addsundesirable thickness.

Another cross-sectional view of a conventional liquid crystal displaymodule is shown in FIG. 3. As shown in FIG. 3, display module 32 mayhave polarizers such as upper polarizer layer 50 and lower polarizer 62.Light guide structure 64 may provide backlight for module 32. The lightfrom structure 64 passes through the display pixels of module 32 andexits display module 32 in direction 31.

Color filter glass layer 52, liquid crystal layer 54, and thin-filmtransistor (TFT) glass layer 58 are interposed between polarizer layers50 and 62.

The polarization of individual pixels of liquid crystal material inliquid crystal layer 54 interacts with the polarizing effects of layers50 and 62 to determine which display pixels block light and which pixelsallow light to pass. Color filter glass layer 52 contains an array ofcolored filters that provide display 32 with the ability to representdifferent colors. The polarization of liquid crystal material in liquidcrystal layer 54 is controlled electrically by thin-film transistorarray 56. Thin-film transistors in array 56 are formed on the uppersurface of thin-film transistor (TFT) glass layer 58.

Thin-film transistors 56 are controlled by drivers contained in drivercircuit 60. Color filter layer 52 is horizontally (laterally) recessedwith respect to TFT layer 58 to form a ledge on which driver circuit 60is mounted. In a typical display module, there may be a number of driverchips such as circuit 60 that are mounted around the periphery of thedisplay. Conductive traces on the upper surface of TFT layer 58interconnect driver circuit 60 with thin-film transistors 56.

In conventional arrangements of the type shown in FIG. 3, black ink 48is placed on the underside of cover glass 36 around the periphery of thedisplay. This creates an opaque region that blocks inactive peripheralportions of display module 32 from view. Black ink 48 can also hidemounting structures such as screw 40 of FIG. 2 from view. Display glass36 may help provide structural support to the display housing of theportable computer in which display module 32 is mounted, but thepresence of glass 36 can add a non-negligible amount of extra thicknessand weight to a display.

Display 14 in device 10 (FIG. 1) may be implemented using a displaymodule with structural enhancements. A display module with illustrativeenhancements is shown in FIG. 4.

FIG. 4 shows a cross-sectional side view of a portion of upper housing26 of device 10 (FIG. 1) in which display module 82 has been mounted.Upper housing 26 may, for example, be formed from machined aluminum.Elastomeric gasket 66 may be used to provide a soft interface betweenpotentially fragile glass layers in module 82 and housing 26.

Display module 82 may produce an image using any suitable displaytechnology (e.g., light-emitting diodes such as an array of organiclight-emitting diodes, liquid crystal display pixels, plasma-basedpixels, etc.). An arrangement in which display module 82 is based onliquid crystal display (LCD) technology is sometimes described herein asan example. The use of LCD structures in display module 82 is, however,merely illustrative. Display module 82 may, in general, be formed fromany suitable type of display structures.

As shown in FIG. 4, display module 82 may have an upper polarizer layer68 and a lower polarizer layer 78. Light guide structure layer 80 mayprovide backlight for module 82. Light-guide structure layer 80 mayinclude light guide structures and diffuser layers. These structures mayhelp route light from a light-emitting diode light source or otherbacklight source through the layers of module 82 in direction 75.

Thin-film transistor substrate glass layer 76 may contain thin-filmtransistors in array 73. Color filter glass layer 70 may contain anarray of optical filters of different colors to provide display module82 with the ability to display color images. Color filter layer 70 maybe formed from glass into which dye of different colors has beenimpregnated, from a glass layer coated with a pattern of colored dye,from a glass or plastic layer that is covered with a pattern of thincolored filter structures (e.g., filters formed from polymer or glasscontaining dye), or any other suitable color filter structures. Liquidcrystal layer 72 may be controlled by the electric fields produced bythe thin-film transistors of array 73.

As shown in FIG. 4, the layer of cover glass that is present inconventional display modules is not present in display module 82 anddevice 10. Rather, color filter layer 70 serves as the uppermost glasslayer in module 82 and device 10. To ensure that module 82 issufficiently robust, color filter layer 70 may be thickened or may bestiffened using support structures on the underside of display module82. Color filter layer 70 may be formed of a durable clear layer (e.g.,a strong glass or plastic) that resists damage from contact.Anti-scratch coatings may also be provided on the surface of colorfilter layer 70 (e.g., as part of polarizer layer 68 or above polarizerlayer 68).

To hide the peripheral portions of display module 82 that lie along theouter edges of display housing 26 from view, an opaque material such asblack ink layer 74 may be incorporated around the periphery of displaymodule 82 to form a black border. Opaque layer 74 may be formed on theunderside of color filter layer 70 or on the upper surface of thin-filmtransistor glass layer 76 (as examples).

With the arrangement of FIG. 4, color filter layer 70 and thin-filmtransistor layer 76 have been extended outwardly (in the leftwarddirection in the orientation of FIG. 4) so as to form an overhangingportion 84 that is supported by the matching ledge in housing 26. Ifdesired, only color filter layer 70 may be extended in this way (e.g.,so that the overhanging portion of layer 70 rests on the ledge formed byhousing 26). In this type of arrangement, the thin-film transistor layermay extend only as far as light-guide structures 80 of FIG. 4. Ifdesired, portions of gasket 66 may be interposed between module 82 andhousing 26 in region 84.

If desired, black ink layer 74 may be formed above color filter glasslayer 70. As shown in FIG. 5, for example, a layer of material such aslayer 86 may be provided on the upper surface of color filter glasslayer 70. Layer 86 may, for example, be a layer of plastic such aspolyester. Ink layer 88 may be printed on the underside of plastic layer86 in region 90. When plastic layer 86 is attached to the surface ofdisplay module 82, the ink in region 90 will block unsightly internalcomponents in housing 26 and module 82 from view by a user. Layers inmodule 82 may be interconnected using fastening mechanisms and adhesive(e.g., optically clear adhesive such as epoxy).

Integrated circuits such as display driver circuits may be incorporatedinto display module 82 to drive display signals into thin-filmtransistor array 73 (FIG. 4). If desired, circuits such as these orother circuits may be mounted on the upper surface of thin-filmtransistor substrate layer 76 under a support member. This type ofconfiguration is shown in FIG. 6. As shown in FIG. 6, circuit 600 may bemounted under support 92. Support 92 may have a recessed portion thataccommodates the thickness of circuit 600. Circuit 600 may be a displaydriver circuit or other suitable electrical component for device 10.

With arrangements of the type shown in FIG. 6, support 92 has about thesame thickness as color filter glass layer 70 and straddles circuit 600.This allows support structure 92 to support layer 86 in peripheralregion 96. Support 92 may be formed from glass, plastic, metal, or othersuitable materials. If desired, color filter glass layer 70 may beprovided with a recess on its underside that accommodates circuit 600.In this situation, a separate support structure need not be used.

Conductive traces, thin-film transistors, and other circuitry 94 may beformed on the upper surface of thin-film transistor substrate 76. Whencircuit 600 is mounted on substrate 76, the traces on the surface ofsubstrate layer 76 may convey signals (e.g., display driver signals) tothe thin-film transistors on layer 76. Other signals may also be routedusing these traces. For example, the traces on layer 76 may be used toroute radio-frequency signals, touch sensor signals, signals associatedwith status indicator lights or other output devices, proximity sensorsignals, etc.

If desired, housing 26 may be formed directly under the edge of thedisplay module layers. This type of arrangement is shown in FIG. 7. Asshown in FIG. 7, display module 82 may have an upper layer formed fromcolor filter 70. Color filter layer 70 may be formed from glass or othersuitable material and includes a pattern of colored pixel-sized filters.A band of opaque material such as ink 88 may be formed on the undersideof the periphery of color filter layer 70. Ink 88 may hide inactiveportions of display module 82 and other structures such as housing 26from view through the upper surface of display module.

An elastomeric member such as gasket 66 may be used to provide aninterface between hosing 26 and the underside of thin-film transistorsubstrate layer 76. Gasket 66 may help prevent glass structures andother structures in display module 70 from being scratched by housing 26(e.g., when housing 26 is formed from aluminum or other hard materials).If desired, gasket 66 may be omitted or gaskets of other shapes may beused.

Light-guide structure 80 may be located under thin-film transistor layer76. Structure 80 may contain light guides for directing light throughthe display, diffuser layers for diffusing light, etc. Polarizer layersmay be incorporated into display module 82 above cover glass layer 70and below thin-film transistor layer 76.

With arrangements of the type shown in FIG. 7, housing 26 may havehousing walls that form a substantially planar rear portion with asubstantially planar exterior rear surface. In the example of FIG. 7,this is shown by planar rear portion 26B. Portions of the housingsidewalls may also protrude vertically upward (in the orientation ofFIG. 7). For example, at least some of housing wall portions 26A aroundthe periphery of housing 26 may extend vertically upward in direction99. At the uppermost portion of peripheral housing walls 26A, housingwall 26A may be provided with a flat horizontal upper surface 101 thatsupports the overhanging lower surface of color filter layer 70 and/orthin-film transistor substrate layer 76 (with optional interveninggasket 66). Because the outermost edge of display module 82 (i.e., theleftmost edges of layers 70 and 76) are laterally (horizontally) alignedwith the outermost edge portions of housing walls 26A along verticalaxis 98, the display module may have the appearance of being borderless.This configuration also allows the active region of the display to beextended close to the outer edge of housing 26.

Electronic device may contain electrical components such as integratedcircuits, antennas, and cameras, etc. Traces may be formed on theunderside of thin-film transistor layer 76 (i.e., the opposite surfaceof layer 76 from the surface on which the thin-film transistors areformed). These traces may be used to help route signals to and from theelectrical components. Openings may also be formed in the layers ofdisplay module 82 to accommodate components. For example, a verticalhole may be formed through color filter layer 82 and thin-filmtransistor layer 76. This hole may be used to receive light for a cameraor to accommodate other electronic components such as a status lightindicator (i.e., a status light-emitting diode), a speaker, amicrophone, a button, or other suitable electrical component.

FIG. 8 is a cross-sectional side view of a display module thatincorporates features such as these. As shown in FIG. 8, display module82 may have color filter glass 70 and thin-film transistor glass layer76. Upper polarizer 68 may be located above color filter glass 70. Lowerpolarizer 78 may be located below thin-film transistor glass layer 76. Acylindrical hole or other suitable opening such as opening 100 may beformed through color filter glass 70 and thin-film transistor glasslayer 76. This hole may be used to accommodate electrical component 102.Electronic component 102 may be a camera, a proximity sensor, an ambientlight sensor, an antenna, a microphone, a speaker, a digital data port,an audio jack or other analog port, a button, a touch sensor, etc.Arrangements in which component 102 is a camera are sometimes describedherein as an example.

Opaque layer 88 may be formed by printing black ink or other suitableopaque material on a plastic layer such as layer 86 that is attached tothe upper surface of polarizer 68 and color filter 70 (as an example).Opaque layer 88 may be formed in a border around the periphery ofdisplay module 82 (i.e., along the outermost edge of housing 26). Toprevent interference with camera 102 (or other electronic component102), it may be desirable omit black ink in the region above opening100.

As with the example of FIG. 7, the illustrative display moduleconfiguration of FIG. 8 is mounted in housing 26 so that the outermostperipheral edges of housing 26 (e.g., edge 103) and the outermost edgesof filter layer 70 and thin-film transistor layer 76 (e.g., edges 105)are laterally aligned (i.e., outermost edges 103 of housing 26 and theoutermost edges 105 of display module 82 are horizontally aligned withthe same vertical axis—axis 98—in the cross-sectional view of FIG. 8).As with the FIG. 7 arrangement, this edge alignment can be maintainedaround the entire periphery of display module 82, providing device 10with a borderless appearance (i.e., with no visible border-shapedhousing structures surrounding the display). If desired, otherconfigurations such as the configuration of FIG. 5 may be used (e.g.,configurations in which housing 26 has vertical sidewalls within whichmodule 82 is mounted to create a visible housing border that surroundsmodule 82 on all four of its outer edges).

Camera 102 contains a digital sensor that generates image data. A flexcircuit cable or other data path may be used to covey camera data fromcamera 102 to storage and processing circuitry in device 10. The uppersurface of thin-film transistor layer 76 contains an array of thin-filmtransistors and associated conductive traces. As shown in thecross-sectional view of FIG. 8, the lower surface of thin-filmtransistor layer 76 may be provided with traces 104. Flex circuit cable106 may have contact pads that are electrically connected to camera 102at end 108 and contact pads that are electrically connected to traces104 at end 110. Using this type of arrangement, camera data can beconveyed using traces 104. This may help reduce or eliminate the needfor additional cables in device 10.

Camera 102 is merely an example of an electrical component for whichsignals may be routed through underside traces on thin-film transistorsubstrate 76. In general, any electrical component that produces orreceives electrical signals in device 10 can be electrically connectedto traces 104. The use of traces 104 on layer 76 can reduce the numberof cables used to route signals between these electrical components andprocessing circuitry in device 10 (i.e., circuits on a main logic boardand other storage and processing circuitry in device 10).

As shown by dashed line 112, an antenna may be formed from some of thetraces 104 on layer 76. Antenna 112 may be, for example, an antenna fora local wireless network or a cellular telephone.

Traces 104 may be formed from any suitable conductor. In typicalconfigurations for display module 82, backlighting is provided bystructures 80. It is therefore typically desirable to form traces 104from transparent conductive materials such as indium-tin oxide. This is,however, merely one illustrative material that may be used for traces104. In general, any suitable conductor may be used. Moreover, it is notnecessary to form traces 104 on the underside of thin-film transistorsubstrate layer 76. Traces 104 may be formed on other glass layers inmodule 82. For example, signal paths for camera signals, antennasignals, or other electrical component signals can be formed fromindium-tin oxide patterns on the surface of a cover glass layer, a colorfilter layer (e.g., layer 70), a glass layer in structures 80, or othersuitable display module layers.

As shown in the cross-sectional view of FIG. 9, ink border 88 may beprovided with opening 87 and polarizer 68 may be provided with opening681. This allows light to pass to and from the lower layers of displaymodule 82, without forming holes in thin-film transistor substrate layer76 and color filter glass layer 70. Even though no hole is formed inlayers 70 and 76 (in the FIG. 9 example), light for electronic component102 may still pass through openings 87 and 681 and may pass through theclear portions of layers 70 and 76 under openings 87 and 681. Electroniccomponent 102 may be a camera, sensor, or other suitable electroniccomponent. Component 102 may receive light along path 89. Component 102may be mounted to the underside of thin-film-transistor layer or, asindicated by dashed line 1020, may be mounted to the underside of colorfilter glass layer 70.

The perspective view of FIG. 10 shows how an electrical component 102(e.g., a camera, sensor, antenna, button, or any other suitablecomponent) may be mounted to the upper surface of thin-film transistorsubstrate layer 76 outside of the active area of display module 82. Theactive area of display module 82 may be aligned with color filter 70 ormay have an area that is somewhat smaller than the surface area of colorfilter 70 (i.e., in alignment with the thin-film transistor array onthin-film transistor substrate 76). As shown in FIG. 10, conductivetraces 94 may also be formed outside of the active area to route signalsto and from electrical component 102.

In the illustrative arrangement of FIG. 11, electrical component 102 hasbeen mounted to an upper surface of color filter glass layer 70.Conductive traces 94 that lie outside of the active area of displaymodule 82 may be used to convey signals to and from electrical component102. Conductive traces 94 may be formed on the upper surface of colorfilter glass layer 70 (e.g., under a polymer coating layer or otherprotective layer) or may be formed on the lower surface of color filterglass layer 70 or the upper surface layer of thin-film transistorsubstrate layer 76. Vias 95 may be formed through color filter glasslayer 70 to interconnect component 102 and conductive traces that havebeen formed lower in the display module stack. Vias may also be formedthrough other glass layers such as thin-film transistor substrate layer76 (e.g., to use traces on the lower surface of the thin-film transistorsubstrate layer to route signals in module 82).

FIG. 12 is a cross-sectional side view of a portion of a display moduleshowing how layers of glass such as cover glass layer 360, color filterglass 70, and thin-film transistor substrate layer 76 may each haveperipheral edge portions 117 that rest on housing wall ledge portion 116of housing 26. Module 82 may be provided with a chassis such as metalchassis member 420. A laterally extending edge portion of member 420 mayalso rest on ledge 116 below cover glass 360, color filter 70, andthin-film transistor substrate 76. Adhesive 114 may be used to securethese layers to housing 26.

FIG. 13 shows an arrangement of the type shown in FIG. 12 in whichelastomeric trim 66 (sometimes referred to as a gasket) has extendingportion 660. Extending portion 660 covers portion 26AA of housing 26 andall of the exposed upper surfaces of housing 26 (i.e., all of surfaces263, 265, and 267, including the portions of surface 263 that areadjacent to peripheral outer edge 269 of housing 26). Because all uppersurface portions of housing 26 are covered (either with cover glass ortrim), the arrangement of FIG. 13 helps improve the cosmetic appearanceof device 10 when viewed from direction 661.

The foregoing is merely illustrative of the principles of this inventionand various modifications can be made by those skilled in the artwithout departing from the scope and spirit of the invention.

What is claimed is:
 1. An electronic device, comprising: a plurality ofglass layers in a display including a color filter glass layer and athin-film transistor substrate layer formed under the color filter glasslayer, wherein the display comprises a layer of light-guide structures,wherein the color filter glass layer and the thin-film transistorsubstrate layer extend laterally past peripheral portions of the layerof the light-guide structures to form an overhanging portion; anelectronic component selected from the group consisting of: a proximitysensor, a digital data port, an audio jack, and an analog port, whereinthe electronic component is mounted on one of the plurality of glasslayers; and traces formed on an upper surface of the thin-filmtransistor substrate that convey signals for the electronic component,wherein the display comprises an opaque coating having an opaque borderand wherein the opaque border blocks peripheral portions of the displayfrom view.
 2. The electronic device defined in claim 1 wherein thethin-film transistor substrate has an array of thin-film transistorsthat define an active area for the display and wherein the traces areformed outside of the active area.
 3. The electronic device defined inclaim 2 wherein the electronic component is mounted to the color filterglass layer.
 4. The electronic device defined in claim 2 wherein theelectronic component is mounted to the thin-film transistor substratelayer.
 5. The electronic device defined in claim 1 wherein theelectronic component comprises the camera.
 6. The electronic devicedefined in claim 1 wherein the electronic component comprises the audiojack.
 7. The electronic device defined in claim 1 wherein the electroniccomponent comprises the analog port.
 8. The electronic device defined inclaim 1 wherein the electronic component comprises the digital dataport.
 9. The electronic device defined in claim 1 wherein the electroniccomponent comprises the proximity sensor.
 10. The electronic devicedefined in claim 1 wherein the one of the plurality of glass layers onwhich the electronic component is mounted comprises a hole.
 11. Theelectronic device defined in claim 1 wherein the one of the plurality ofglass layers on which the electronic component is mounted comprises ahole and wherein the hole is disposed over the electronic component thatis mounted on the one of the plurality of glass layers on which theelectronic component is mounted.
 12. The electronic device defined inclaim 1 wherein the one of the plurality of glass layers on which theelectronic component is mounted comprises a hole, wherein the hole isdisposed over the electronic component that is mounted on the one of theplurality of glass layers on which the electronic component is mounted,and wherein portions of the electronic component extend into the hole.13. The electronic device defined in claim 1 wherein the one of theplurality of glass layers on which the electronic component is mountedcomprises a hole, wherein the hole is disposed over the electroniccomponent that is mounted on the one of the plurality of glass layers onwhich the electronic component is mounted, and wherein portions of theelectronic component extend into the hole and extend entirely throughthe one of the plurality of glass layers on which the electroniccomponent is mounted.
 14. The electronic device defined in claim 1wherein the electronic component comprises the camera, wherein the oneof the plurality of glass layers on which the electronic component ismounted comprises a hole through which the camera receives light.
 15. Anelectronic device, comprising: a plurality of layers in a displayincluding a color filter layer and a thin-film transistor substratelayer, wherein the display comprises a layer of light-guide structures,wherein the color filter glass layer and the thin-film transistorsubstrate layer extend laterally past peripheral portions of the layerof the light-guide structures to form an overhanging portion; anelectronic component selected from the group consisting of: a camera, aproximity sensor, a digital data port, an audio jack, and an analogport, wherein the electronic component is mounted on one of theplurality of layers in the display; and signal traces formed on a firstsurface of the thin-film transistor substrate that convey signals forthe electronic component, wherein the display comprises an opaquecoating having an opaque border and wherein the opaque border blocksinactive peripheral portions of the display from view.
 16. Theelectronic device defined in claim 15 further comprising: thin-filmtransistors formed on a second surface of the thin-film transistorsubstrate layer.
 17. The electronic device defined in claim 15 whereinthe thin-film transistor substrate layer is formed under the colorfilter layer.
 18. The electronic device defined in claim 15 furthercomprising: thin-film transistors formed on a second surface of thethin-film transistor substrate layer, wherein the first surface of thethin-film transistor substrate layer comprises a lower surface of thethin-film transistor substrate layer and wherein the second surface ofthe thin-film transistor substrate layer comprises an upper surface ofthe thin-film transistor substrate layer.
 19. The electronic devicedefined in claim 15 wherein the thin-film transistor substrate has anarray of thin-film transistors that define an active area for thedisplay and wherein the traces are formed outside of the active area.20. The electronic device defined in claim 19 wherein the electroniccomponent is mounted to the color filter layer.
 21. The electronicdevice defined in claim 19 wherein the electronic component is mountedto the thin-film transistor substrate layer.
 22. The electronic devicedefined in claim 15 wherein the one of the plurality of layers on whichthe electronic component is mounted comprises a hole and wherein thehole is disposed over the electronic component that is mounted on theone of the plurality of layers on which the electronic component ismounted.
 23. The electronic device defined in claim 15 wherein the oneof the plurality of layers on which the electronic component is mountedcomprises a hole, wherein the hole is disposed over the electroniccomponent that is mounted on the one of the plurality of layers on whichthe electronic component is mounted, and wherein portions of theelectronic component extend into the hole and extend entirely throughthe one of the plurality of layers on which the electronic component ismounted.
 24. The electronic device defined in claim 15 wherein theelectronic component comprises the camera, wherein the one of theplurality of layers on which the electronic component is mountedcomprises a hole through which the camera receives light.
 25. Anelectronic device, comprising: a plurality of layers in a displayincluding a color filter layer and a thin-film transistor substratelayer, wherein the display comprises a layer of light-guide structures,wherein the color filter layer and the thin-film transistor substratelayer extend laterally past peripheral portions of the layer oflight-guide structures to form an overhanging portion; an electroniccomponent selected from the group consisting of: a camera, a microphone,a sensor, and an antenna, wherein the electronic component is mounted onone of the plurality of layers in the display; and signal traces formedon a first surface of the thin-film transistor substrate that conveysignals for the electronic component, wherein the display comprises anopaque coating having an opaque border and wherein the opaque borderblocks inactive peripheral portions of the display from view.
 26. Theelectronic device defined in claim 15 further comprising a flex circuitcable that connects the electronic component to the conductive traces onthe first surface of the thin-film transistor substrate layer.